Greene, Tweed understands the process relationships between materials, design and challenging applications that confront chip-equipment manufacturers, fabs and foundries. Through close partnerships with the world's leading OEMs and fabs, we develop solutions to improve the efficiencies of their equipment and their mean time between failure by optimizing materials and component designs.
Our critical process seals minimize microcontamination and offer excellent chemical resistance to maximize seal-life expectancy in wet and dry wafer fabrication processes. Our broad line of plastic materials can be utilized to provide minimal extractable ion content, significant plasma resistance, low particle generation and high-dimensional stability, making our plastics ideal for wafer-fabrication chamber components and wafer-handling applications. Our engineered products reduce system downtime and lower the cost of ownership.
| Our new High-performance Thermoplastic brochure is available in an easy-to-use, electronic format. Click here to learn more about our materials, design and manufacturing capabilities with thermoplastics in the semiconductor industry.
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Coatings
Functional Gaskets
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CAPABILITIES
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