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Chemraz® 644

Minimal Contamination in Dry Plasma Etching Processes

SEALING SOLUTIONS

Specifically developed to meet the demands of aggressive dry plasma systems and the corresponding remote O2 cleaning processes, Chemraz® 644, a perfluoroelastomer with a unique formulation, provides enhanced plasma resistance and minimal contamination resulting in less downtime and higher wafer processing yields. Recommended primarily for both static and dynamic oxide etch wafer processing applications, Chemraz 644 remains stable at service temperatures up to 315ºC (600°F).

Features & Benefits

  • Excellent plasma resistance in a variety of aggressive chemical environments
  • Minimal particulation
  • Withstands high service temperatures up to 315ºC (600°F)

APPLICATIONS

  • Endpoint windows
  • Bell jar seals
  • Valve seals
  • KF fitting seals
  • Window seals
  • Isolator valve seals
  • Lid seals
  • Gas inlet seals
  • Slit valve seals
  • Chamber seals

RECOMMENDED PROCESS APPLICATIONS

  • Dry plasma etch
  • Remote O2 plasma cleans
  • Dry ashing

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* Note: Unless otherwise indicated, all tests are performed on AS 568A (-214) O-rings. ** Consult GT Sales/Engineering for applications that require continuous service temperatures above 80% of the maximum temperature.

* Note: Unless otherwise indicated, all tests are performed on AS 568A (-214) O-rings.
** Consult GT Sales/Engineering for applications that require continuous service temperatures above 80% of the maximum temperature.



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