The Barrier Bonded Slit Valve Door or “BBSV” significantly increases the life expectancy and performance of the door’s seal during semiconductor plasma processing. Made from Greene, Tweed’s proprietary high-purity PTFE compound—Avalon®—the shield enhances our unique BSV (Bonded Slit Valve) Door design.
In the past, when O-ring replacement was the only option, cleaning the gland and installing a new O-ring was difficult. Greene, Tweed’s introduction of the BSV Door in 1997 extended seal lifetime by an order of magnitude. Installation requires only removing and replacing a few bolts when replacing the complete BSV door assembly. Still, the highly aggressive nature of plasma radicals in both plasma etch and post-CVD chamber clean applications physically erodes the bonded seal over time.
With the BBSV door design, the Avalon® shield protects the bonded Chemraz® seal from direct plasma attack. Therefore, a barrier bonded-gate design can provide up to a 30-fold increase in seal life during wafer production as compared to standard gate valve designs.