The Bonded Slit Valve Door or “BSV” increases the life expectancy and performance of the door’s seal during semiconductor processing. Made from Greene, Tweed’s proprietary perfluoroelastomer compound—Chemraz® (or other customer requested elastomers)—the seal is bonded to an aluminum/stainless steel door.
In the past, when O-ring replacement was the only option, cleaning the gland and installing a new O-ring was difficult. Now installation requires only removing and replacing a few bolts when replacing the complete BSV door assembly.
Also, a bonded design minimizes abrasion leading to less particula-tion in many processes compared to installation of a typical perflu-oroelastomer O-ring. Therefore, a bonded-gate design can provide up to a 10-fold increase in seal life during wafer production.