Greene Tweed’s ONX® 600, a fluoropolymer-based carbon-fiber-reinforced composite, is a high-strength, high-purity material that withstands strong acid chemistries at high temperatures.
Used in wafer cleaning, ONX® 600 is resistant to SPM (sulfuric-peroxide, Piranha), SC1 (ammonium hydroxide-peroxide), SC2 (HCl-peroxide), and dilute HF cleaning solutions.
ONX® 600 is recommended for precision components, is stable to wet process temperatures up to 200°C (392°F), and is pure enough for applications that must contact the wafer edge. Moreover, because Silicon is harder than ONX® 600, edge damage and particles are minimized. Finally, ONX® 600 is electrically conductive to remove static charges caused by spin-spray actions, protecting delicate features of semiconductor devices.
ONX® 600 offers enhanced performance and reduced cost of ownership over other fluoropolymer materials. It maximizes equipment capability and reliability through outstanding mechanical properties and consistent quality, making it an ideal choice for the challenging specifications of OEM equipment manufacturers.
Component sizes up to 20 inches in diameter can be accommodated.