SEALING SOLUTIONS

Chemraz® 639 perfluoroelastomer (FFKM) is specifically developed by Greene, Tweed to meet the rigorous demands of aggressive plasma systems. This product’s unique formulation provides enhanced plasma resist-ance in oxygen and fluorine plasma processes resulting in minimal contamination, less downtime and higher wafer processing yields. Chemraz® 639 is developed from an advanced polymer utilizing fluoro-polymer nano-composite technology particles. Recommended for both static and dynamic dry wafer processing applications such as etch, remote plasma cleans, and deposition (CVD, HDPCVD, etc.), Chemraz® 639 remains stable at service temperatures up to 260ºC (500°F).

Features & Benefits

  • Exceptional plasma resistance in oxygen and fluorine environments
  • Minimal particulation and surface degradation
  • High purity, very low metallic ion content

APPLICATIONS

  • Endpoint windows
  • Bell jar seals
  • Valve seals
  • KF fitting seals
  • Window seals
  • Isolator valve seals
  • Lid seals
  • Gas inlet seals
  • Slit valve seals
  • Chamber seals
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RECOMMENDED PROCESS APPLICATIONS

  • Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
  • Dry plasma etch
  • Remote plasma cleans
  • Dry ashing
  • Oxidation (LPCVD)/Diffusion
  • Metalization (CVD, PVD, sputtering, evaporation)


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