Chemraz® 639 perfluoroelastomer (FFKM) is specifically developed by Greene, Tweed to meet the rigorous demands of aggressive plasma systems. This product’s unique formulation provides enhanced plasma resist-ance in oxygen and fluorine plasma processes resulting in minimal contamination, less downtime and higher wafer processing yields. Chemraz® 639 is developed from an advanced polymer utilizing fluoro-polymer nano-composite technology particles. Recommended for both static and dynamic dry wafer processing applications such as etch, remote plasma cleans, and deposition (CVD, HDPCVD, etc.), Chemraz® 639 remains stable at service temperatures up to 260ºC (500°F).