HIGH TEMPERATURE MATERIAL

Chemraz® 640 perfluoroelastomer (FFKM) is specifically developed by Greene, Tweed to meet the rigorous demands of aggressive plasma systems. This product’s unique formulation provides enhanced plasma resistance in oxygen and fluorine plasma processes resulting in minimal contamination, less downtime and higher wafer processing yields. Chemraz® 640 is recommended for both static and dynamic, wet and dry wafer processing applications such as etch, remote plasma cleans, and deposition (CVD, HDPCVD, etc.) Chemraz® 640 remains stable at service temperatures up to 554ºF (290ºC).

Features & Benefits

  • Exceptional plasma resistance in oxygen and fluorine environments
  • Minimal particulation and surface degradation
  • High purity, very low metallic ion content
  • Extended performance and added reliability in wet and dry applications

APPLICATIONS

  • Endpoint windows
  • Valve seals
  • Isolator valve seals
  • Lid Seals
  • Gas inlet/outlet seals
  • Slit valve seals
  • Chamber seals
  • Gasket seals
  • Dispensing seals
  • Regulator seals
  • Filler seals
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RECOMMENDED PROCESS APPLICATIONS

  • Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
  • Dry plasma etch
  • RTP/Diffusion
  • Remote plasma cleans
  • Dry ashing
  • Oxidation (LPCVD)
  • Wet etch (acid, base)
  • Wet stripping (solvents)
  • Wet cleaning (UPDI)
  • Wet metal plating
  • Electro chemical deposition


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