Chemraz® XCD, a perfluoroelastomer (FFKM), is specifically designed to exceed the most rigorous demands of front-end semiconductor thermal processing equipment. Chemraz XCD withstands the extreme thermal challenges typically found in LPCVD (low pressure chemical vapor deposition), RTP (rapid thermal process) and epitaxial deposition systems.

Because of its unique polymer and filler structure, Chemraz XCD provides the lowest compression set at high operating temperatures (> 300°C/572ºF) of any perfluoroelastomer available on the market, resulting in increased seal integrity and longer seal lifetimes. This means reduced downtime and higher wafer processing yields. With the lowest outgassing profile for perfluoroelastomer materials in high-temperature applications, Chemraz XCD provides a cleaner process environment. Because of its reduced surface stiction, Chemraz XCD can be used for semi-dynamic as well as static sealing applications. Chemraz XCD remains stable at operating temperatures up to 300ºC (572ºF) while maintaining exceptional compression set.


  • Outstanding resistance to extreme heat broadens thermal budgets
  • Minimal compression set at elevated temperatures ensures extended sealing integrity
  • High purity and lower outgassing assures cleaner processing
  • Reduced sticking increases longevity in semi-dynamic applications and facilitates installation and removal


  • Chamber seals
  • Gas inlet/outlet seals
  • Gate valve seals
  • Isolator valve seals
  • Reaction chamber lid seals
  • Seals in close proximity to high-temperature wafer heaters
  • Slit valve seals
  • Tube capping seals
Chemraz Xcd


  • LPCVD (low pressure chemical vapor deposition)(Silicon Nitride, Silicon Oxide)
  • RTP (rapid thermal process)
    (Annealing, Oxidation, Nitridation, Silicidation)
  • Epitaxial deposition
  • Thermal CVD
  • Atomic layer deposition
  • Silicon wafer ingot growing
  • SOI annealing