Chemraz® XRZ, a perfluoroelastomer (FFKM), is specifically developed to exceed the most rigorous demands of aggressive insitu NF3 plasma cleaning. Chemraz® XRZ withstands the application challenges typically found in HDPCVD (High Density Plasma Chemical Vapor Deposition), PECVD (Plasma Enhanced CVD) and newer PEALD (Plasma Enhanced Atomic Layer Deposition) process chambers. Because of its unique molecular composite structure, Chemraz® XRZ provides the highest plasma resistance available to fluorine plasma processes, resulting in minimal contamination. This leads to increased seal integrity and longer seal lifetimes, reducing downtime and driving higher wafer processing yields. Chemraz® XRZ can be used for both static and semi-dynamic dry wafer processing applications such as etch, deposition (CVD, HDPCVD, PEALD, etc.) and remote plasma cleans. Chemraz® XRZ remains stable at operating temperatures up to 300ºC (572ºF) while maintaining exceptional compression set.

Features & Benefits

  • Outstanding plasma resistance in highly corrosive fluorine environments with minimal seal degradation
  • Excellent surface resistance for minimal particulation and sealing integrity
  • High purity for minimal contamination risk
  • Minimal compression set at elevated temperatures ensures seal integrity
  • Extended equipment uptime with added reliability in dry applications


  • Chamber seals
  • Endpoint windows
  • Gas inlet/outlet seals
  • Gate valve seals
  • Isolator valve seals
  • Reactant delivery system seals
  • Reaction chamber lid seals
  • Slit valve seals


  • Deposition (CVD, PECVD, HDPCVD, PEALD)
  • Plasma etch (fluorine species)
  • Remote fluorine plasma cleans

Chemraz® XRZ, collaborative innovation from GREENE, TWEED CO., INC., and DAIKIN INDUSTRIES, LTD.