SEALING SOLUTIONS

Specifically developed to meet the demands of aggressive dry plasma systems, Chemraz® 657 perfluoroelastomer’s (FFKM) unique formulation provides enhanced plasma resistance and minimal contamination resulting in less downtime and higher wafer processing yields. Recommended primarily for both static and dynamic oxide etch wafer processing applications, Chemraz® 657 remains stable at service temperatures up to 280ºC (536°F) with excursions to 300ºC (572°F).

Features & Benefits

  • Excellent plasma resistance in a variety of aggressive chemical environments
  • Minimal particulation
  • Withstands high service temperatures up to 280ºC (536°F) with excursions to 300ºC (572°F)

APPLICATIONS

  • Endpoint windows
  • Bell jar seals
  • Valve seals
  • KF fitting seals
  • Window seals
  • Isolator valve seals
  • Lid seals
  • Gas Inlet seals
  • Slit valve seals
  • Chamber seals
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RECOMMENDED PROCESS APPLICATIONS

  • Dry plasma etch
  • Deposition (CVD, PECVD, RPCVD, HDPCVD, APCVD, SACVD, DCVD)
  • Remote plasma cleans
  • Dry ashing
  • Oxidation (LPCVD)
  • Diffusion
  • Metalization (CVD, PVD, sputtering, evaporation)


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