
Semiconductor

Industries - Semiconductor
Advanced Solutions for Semiconductor Fabrication
Innovative Products
Resist wear and tear from wafer cleaning, patterning, and deposition. Boost productivity. Reduce contamination and costs. Our sealing solutions combat the harsh plasmas and chemicals in wafer fabrication processes.
Years of experience designing solutions for Semiconductor applications
Greene Tweed is the first in the nation to use cleanroom manufacturing. Leading semiconductor fabs, foundries, and OEMs trust our solutions for their critical applications.
We have evolved our sealing design and development to keep up with the advancing semiconductor industry. Chemraz® seals withstand the plasmas used in cutting-edge deposition and etch wafer processing. ONX® 600 composite components resist harsh chemicals used in semiconductor manufacturing. Our range of solutions includes bonding, encapsulation, and coating capabilities for extra protection.
Expert Application Engineering
Perform Under Pressure
Etching
Etching is an aggressive process that removes surface layers from a wafer surface during manufacturing by bombarding the wafer with ions. Greene Tweed builds products for the dry etch vacuum environment:
- Seals
- O-rings
- E-seals
- Avalon® shields for BSV doors
- Focus rings
- Mechanical fasteners
Improve Sealing Integrity
Valve Seals
We manufacture semiconductor fabrication valve sealing solutions with a range of benefits:
- Improve sealing integrity, reduce wear. Our PTFE shields against process exposure to seals and extends their lifespan.
- Simplify installation, avoid time-consuming O-ring replacement. Bonded Slit Valve Door (BSV) solutions allow for replacement of a few bolts to complete BSV door assembly.
Our portfolio materials like Chemraz® bond seals to aluminum or stainless steel doors. This combines the door and seal into one piece to get rid of traditional molded parting lines and limit particle generation. Our bonded designs last up to 10x longer than typical perfluoroelastomer O-rings.
Turn up the Temperature
Wafer Handling
ONX® 600, a fluoropolymer-based, carbon-fiber-reinforced composite, is a high-strength, high-purity material that withstands strong acid chemistries at high temperatures.
We make components like wafer-handling pads (fangs) for robots that transfer wafer during processes like doping, ion implantation, etching, and thin-film deposition to:
- Avoid sticking to the robot blade.
- Prevent wafer from flying off the robot blade.
- Give high-temperature endurance for hot wafers.
- Provide wear resistance on the robot blade.
- Reduce sticking with proprietary surface finishes on pads.
Boost Semiconductor Production
Electroplating
Greene Tweed is an industry leader in edge exclusion technology. We manufacture our seals to enhance performance, extend seal life, and reduce sticking.
The Enduro™ LF10 is a thin conformal, PTFE-based coating that fortifies components in manufacturing equipment like elastomerics, thermoplastics, or metals.
Our edge exclusion products maximize the wafer surface to process more chips. They seal the edge of the wafer and put an end to plating on the backside of the wafer.