Chemraz® XTR, a perfluoroelastomer (FFKM), is specifically designed to withstand the highly corrosive environments that commonly occur from using ClF3 as a cleaning gas. Chemraz® XTR addresses application challenges typically found in ALD (Atomic Layer Deposition) of titanium nitride and other nitride-based film deposition. With its unique molecular composition combined with fillers, it provides the highest available chemical resistance to thermal cleaning processes utilizing ClF3, resulting in minimal contamination, minimal weight loss and longer seal lifetime. This means less downtime and higher wafer-processing yields.
Chemraz® XTR is recommended for both static and semi-dynamic applications in systems used for fi lm deposition and etching, specifically for ALD of new barrier layers for advanced devices. These layers consist of materials that are difficult to etch; therefore, ClF3 is employed for cleaning. Chemraz® XTR has high chemical resistance to corrosive fluorine-based chemistries at elevated temperatures. In addition, Chemraz® XTR remains stable to service temperatures exceeding 300°C (572°F) while demonstrating exceptional compression set resistance. This combination of excellent chemical resistance and low compression set in the extremely elevated temperatures found in process chambers extends seal longevity.