Greene Tweed’s materials portfolio offers a wide variety of solutions to solve the critical operational issues facing the Semiconductor markets.
Our Chemraz® perfluoroelastomers offer increased plasma resistance and reduced particulation for enhanced productivity and cleanliness.
Our Onx™ line of fluro plastic composite materials can be found in a variety of wafer-handling applications, including structural components, brackets, and spinner chucks. ONX™ 600, a fluoropolymer-based, carbon-fiber-reinforced composite, is a high-strength, high-purity material that withstands strong acid chemistries at high temperatures.
With low particulation and high dimensional stability, our Arlon® and Avalon® engineering thermoplastics are an excellent option for wafer processing and handling applications, including ESC bushings and wafer pedestals.
Chemical Mechanical Polishing (CMP)
CMP, a process that smoothes surfaces by combining chemical and mechanical polishing, is a hybrid of chemical etching and free abrasive polishing. It typically involves the use of an abrasive and corrosive chemical slurry with a polishing pad and retaining ring, usually with a larger diameter than the wafer.
Greene Tweed’s plastics provide a low ionic content and a low wear rate in retainer ring applications.
Greene Tweed’s retainer rings, made of Arlon®, our industry leading engineering thermoplastic, provide exceptional plasma, chemical, wear, and high-temperature resistance.
Deposition is any process used to grow, coat, or transfer a material onto a wafer.
Chemical Vapor Deposition (CVD)
CVD, PVD, or vacuum deposition in general, deposit a solid material from a vapor by a chemical reaction occurring on or in the vicinity of a normally heated substrate surface.
Greene Tweed supplies parts to our customers for CVD processes, including o-rings, elastomeric materials, slit-valve doors, and dovetail and gland lock seals.
Electro chemical deposition is a process by which a thin film/coating of metal, oxide, or salt can be deposited onto the surface of a conductor substrate by simple electrolysis of a solution containing the desired metal ion or its chemical complex. Typical semiconductor plating deposits copper on a wafer surface and/or provides advanced packaging to plate bumps in tin/silver and other materials.
Greene Tweed manufactures seals with innovative technologies that enhance performance, extend seal life, and reduce sticking.
Edge exclusion is the amount of the wafer edge that is not “processable.” The lower the amount of edge exclusion, the more chips can be made.
Edge Exclusion Products
Greene Tweed’s edge exclusion products maximize the wafer surface that can be processed into chips. They seal the edge of the wafer and eliminate plating on the backside of the wafer.
Greene Tweed, an industry leader in edge exclusion technology, offers Enduro™ LF10, a thin conformal, PTFE-based coating that can be applied to a variety of components within manufacturing equipment, including elastomeric, thermoplastic, or metal components to enhance their performance.
Visit our Chemraz® microsite for more information.
SubFab / Vacuum Pumps
Hazardous exhaust gases must be abated either chemically or thermally in the SubFab prior to disposal handled after semiconductor processes.
Greene Tweed seals and o-rings are used in pumps, scrubbers, piping, valves, and flanges in the SubFab, including KF fittings for high-temperature and aggressive chemical applications.
Visit our Chemraz® microsite for more information.
Greene Tweed offers a variety of sealing solutions for valves used in semiconductor processing operations, including a bonded option that is designed to eliminate movement in the gland – leading to improved sealing integrity, less wear and simplified installation, as well as additional shielding with PTFE to minimize process exposure to the seal, further enhancing seal lifetime
In the past, when O-ring replacement was the only option, cleaning the gland and installing a new O-ring was difficult and time consuming. Greene Tweed’s Bonded Slit Valve Door or “BSV” solution simplifies that process. Now installation requires only removing and replacing a few bolts when replacing the complete BSV door assembly.
Our seals are manufactured from our proprietary portfolio of materials, including Chemraz®. The seal is bonded to an aluminum or stainless-steel door. Having the door and the seal as one piece decreases the replacement downtime, simplifies installation and ensures proper seal orientation. In addition, our solution has no traditional molded parting lines and has limited particle generation to minimize contamination.
Our bonded design also provides for optimal compression set and minimizes abrasion leading to less particulation in many processes compared to installation of a typical perfluoroelastomer O-ring. All these factors together mean that our bonded-gate design can provide up to a 10-fold increase in seal life during wafer production.
Wafer Handling / Lift Pins / Pads
Wafer-handling robots are used in the fab to transfer wafers during many different processes, including doping, ion implantation, etching, and thin-film deposition.
Greene Tweed supplies parts for these robots, particularly wafer-handling pads (fangs) that are installed to reduce sticking on the robot blade and to:
- Prevent wafer from flying off the robot blade
- Offer high-temperature capability for hot wafers
- Provide wear resistance on the robot blade
- Reduce sticking with proprietary surface finishes on pads
Visit our ONX and Engineered Components pages for more information.
Wet Cleaning and Surface Preparation
Wet cleaning and surface preparation materials are used to prepare wafers during their many semiconductor process steps. SEMI-F57 has established the industry standards semi fluid-component manufacturers must follow regarding extractable ions, metallic anions, and total oxidizable carbon (TOC). When followed, these best practices will help to ensure proper cleaning and eliminate the presence of metals in the bath.
Greene Tweed’s Chemraz® 551 and Chemraz® 570 offer broad chemical resistance for aqueous wafer processing and wet processing applications where stringent seal reliability and contamination control is required.
Visit our Chemraz page for more information.
Chemical Compatibility Guide
Selecting the right elastomer and the right seal design is a difficult task. Our Chemical Compatibility Guide addresses the ability of the seal material to resist the contacting fluid. Greene Tweed offers a broad range of elastomers, as shown in this guide. Chemraz®, a perfluoroelastomer combining the broad, almost universal chemical resistance of PTFE with the resilience of elastomers, is our most chemically resistant material.
Elastomer Center of Excellence
Seeking progress and advancing the next generation of technology is what Greene Tweed is all about. The launch of our Elastomer Center of Excellence is our latest endeavor to service our semiconductor customers in new and innovative ways that bring solutions to market faster.
Located at our Advanced Technology Group Headquarters in Kulpsville, PA, the Center is dedicated to the advancement of new elastomer compounds and offers complete integration of our processes – from initial raw material mixing and development to prototype product packaging.
The Center’s capabilities bring speed, efficiency, and agility that accelerates the pace of new semiconductor compound development for our customers:
- 2,200 Ft2 Cleanroom – our all-inclusive cleanroom environment delivers the highest quality products with industry standard contamination controls. For our semi customers, we can develop the industry’s most advanced perfluoroelastomers that meet stringent quality and cleanliness requirements
- Process Systems – the Center’s process systems feature some of the highest industry lab standards and include mixing mills/internal mixers, extruders, press systems, post-cure ovens, inspection systems, and a cleaning & packaging area
- Additional Capabilities – application-specific exposure experiments with plasma etch systems and UV/ozone systems; instrumentation capability for composition/morphology, and material properties